The bumps appear to be coming from the little metal tensioning tabs pressing against the back of the screen through the copper heat transfer tape a little too hard.
https://youtu.be/xEBYVJ2_r_Q?t=103
https://youtu.be/0poyvpB7Fkw?t=193
iPhone 15 has these tabs but only on the reinforced edges of the frame and Samsung doesn’t use them at all for Galaxy S series
Bizarre design choice from Google to have the tabs press directly into the back of the screen…
Use these settings on top of XMP
SVID Behavior = Typical
Digi+ LLC = 4
TX VDDQ = 1.35v
IMC VDD = 1.35v
Strix Z790-H should be cheaper than Strix Z790-A
You should check if you actually need the A/E features over H.
If you carried over the Windows install from another chipset motherboard, you should reinstall the Chipset INF utility and also reset your Windows power plans.
The board was more insulated than usual from the actual company because of the weird corporate structure of OpenAI and some members were uniquely unqualified.
Follow these instructions for ASUS
Skip the TVB part since you’re trying to reduce power, but everything else applies.
I recommend using Process Lasso proper. It’s not hard to learn and much more powerful. CoreDirector looks like Process Lasso’s Efficiency mode/CPU set/CPU affinity rules repackaged into one on/off toggle for every listed app.
You can do more interesting rules with Process Lasso like keeping non-interactive applications off of the highest-turbo P-cores or restricted to E-cores to improve idle power. My 60/60/60/60/57/57/57/57 13900K idles at 8-9W with MSI AB, Discord*, Steam, and other apps banished to E-cores and never allowed to turbo the P-cores.
*Discord gets 57x P-cores 6 and 7 as a treat.
Disabling HT usually gives another 100-200MHz at the same load line just because the core pulls less power and runs cooler.
Try 5.8/5.6/5.5 with OCTVB break points at 60C and 70C.
Sadly, no other details were shared at this time on these upcoming CopprLink PCIe cables. The name is arguably a bit odd and separately there is already CopperLink Ethernet cables from a company Patton Electronics. CopprLink hasn’t appeared yet on the USPTO trademark search for reavealing its styling or other details.
…
As for Metro Exodus, it’s more like:
When game devs get too ambitious and spawns SystemInfo.processorCount() workers for a 32-thread battleroyale in the L3$
APO still slightly outperforms E-cores off and HT off in this game, so I’m assuming APO does something useful with the 16MB of L2$ to take pressure of the L3$
I recently got one of these as a curiosity when their Amazon storefront had a coupon. Mildly impressed at how ‘quiet’ they are for the 2400 RPM rating. Still wouldn’t ever run them at 2400 RPM but I’d rather these at 2400 RPM than the NF-A14 iPPC at 2000 RPM if I had to run a 140mm fan that fast.
More watts = more amps = more voltage drop from LLC AND higher voltage requirement from increased temperature.
You need to increase the AC load line configuration to counter the increased voltage drop, but first consider whether an additional 2-3% all-core performance is worth the 20-30% higher power required.
P3, P5, P7 are all on one side of the CPU, so it’s likely the cooler pressure on the CPU IHS isn’t even for some reason.
Some ideas:
Use more paste and make sure the paste imprint is even.
Double check to make sure you didn’t mix the LGA1200/1700 standoffs which are different lengths.
Make sure the excessively large universal Arctic mounting frame isn’t catching on a VRM component.
Make sure the contact frame tension is even across all four screws