• nooneisback@alien.topB
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        11 months ago

        Sounds like a design flaw. The Qualcomm QCM6490 isn’t a top-end chip, so they can’t use cooling as an excuse, when an Xperia 1 V manages to fit enough cooling for a Snapdragon 8 Gen 2 and a jack in practically the same size. This industry really needs more competition that’s repair friendly and has all the features, without following trends mindlessly.

        • tjeulink@alien.topB
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          11 months ago

          what it doesn’t manage is not being glued and being modular. both require space. good luck replacing your usb-c port on that one or god forbid your screen, if you can even get an ODM part.

          • nooneisback@alien.topB
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            11 months ago

            I have an Xperia 1 IV. Not without its flaws, but it fits all my requirements, and I don’t mind the weird DSLR-like cameras one wouldn’t expect from a phone.

          • nooneisback@alien.topB
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            11 months ago

            The phone I mentioned also has a bigger battery capacity. I guess repairability brings some space inefficiency since you need to make all the components accessible.

            • RedstoneRelic@alien.topB
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              11 months ago

              Yup, screws and tabs take up more space than glue unfortunately. I’m not happy about the loss of the headphone jack, but I’d take a repairable phone from a company that has staying power than a comparable phone that isn’t repairable with a headphone jack.