• Scafir@discuss.tchncs.deOP
    link
    fedilink
    English
    arrow-up
    4
    ·
    1 year ago

    We are working towards having a product properly packaged. This is a prototype that is not mature enough yet to justify the cost/time to package it. Moreover, this custom chip is used to measure ultra low currents (down to femto amps), so any packaging could potentially interfere with the measurement capabilities (-> no epoxy). It is however protected by a large shielding box, but it’s no use during assembly/modifications :/