• Varyk@sh.itjust.works
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    16 hours ago

    you have practical, working tsmc chips plus next-gen r&d versus theoretical chips from Intel, a company that has not fared well over 30 years of trying to catch up with TSMC.

    they’re not worried yet.

      • tal@lemmy.today
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        8 hours ago

        It does sound like most of that was not actually manufacturing, but design.

        • Cort@lemmy.world
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          5 hours ago

          If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.

          But if you’re talking about 10th Gen chips that took forever to get out of the gate due to issues with sub 14nm lithography, then no it’s a hardware issue. Intel has had issues over recent years with actual die shrinks.

          • RubberDuck@lemmy.world
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            5 hours ago

            Regardless, it feels like what we see with Boeing. A company culture that prioritized marketing and time to market over everything else consequences be damned.

            Move fast and break stuff is probably not the best strategy if you are building airplanes or processors or other PhD level stuff… Or maybe it’s just never a good strategy.

            • Cort@lemmy.world
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              5 hours ago

              Yeah nice fast and break things is a great way to maximize short term profits at the expense of the long term. But fuck it, I got mine in the short term, so it works.

          • tal@lemmy.today
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            5 hours ago

            If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.

            Yes, I was, but there was also some initial manufacturing issue with oxidation. That wasn’t the bulk of the issues that they were running into, though.